Rambus - builds another toll plaza

United States Patent 6,902,953
Haba June 7, 2005

Methods of forming semiconductor stacked die devices

Abstract
Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, a method comprises forming at least one conductive structure within a plurality of semiconductor substrates, said act of forming comprising first forming said at least one conductive structure to extend into a respective semiconductor substrate a distance that is less than an elevational thickness of the substrate, and second removing substrate material elevationally adjacent said one conductive structure effective to expose a surface of said one conductive structure, at least portions of one of the conductive structures having oppositely facing, exposed outer surfaces; and stacking individual substrates together such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate.

Inventors: Haba; Belgacem (Cupertino, CA)
Assignee: Rambus Inc. (Los Altos, CA)
Appl. No.: 706897
Filed: November 13, 2003

Hat tip to FinzToRite of the Pinehurst Thread for the link.