Qimonda AG announced (3/7/07) the planned expansion of its existing facility for the assembly and testing of memory ICs (back-end) in the Suzhou Industrial Park, Suzhou, China, located 80 kilometers west of Shanghai. Construction of the new facility is scheduled to begin in March 2007, with the site ready for the equipment installation by late 2007. A new clean room of 10,000sqm will be added to the existing clean room of 10,000sqm. The expansion will also result in a significant increase of headcount. The facility currently has about 1,700 staff. At full capacity, the headcount is expected to move beyond 3,000 employees.
Read more from the Qimonda press release.
Qimonda AG announced (3/7/07) the building of a new DRAM module manufacturing facility in Johor, Malaysia, close to the border with Singapore. The overall investment for this new DRAM module manufacturing facility in Malaysia including IT integration, infrastructure and equipment will total up to Euro 150 million over the next five years. The start of construction is planned for mid of calendar year 2007, while production is expected to begin in 2008.
Read more from the Qimonda press release.
On January 3, 2007 Rambus Inc. announced that Qimonda and Rambus signed a technology license for XDR™ DRAM.
Wednesday, March 07, 2007
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