Monday, November 20, 2006

Rambus Inc. PR Department finding its groove?

If you have signed up for email from Rambus Inc. you may have had a press release land in your in box last week (11/17/06). Good news this time. Good job
Ms. Collier. Even more interesting is the fact that Google Alerts have virtually poured into my box alerting me of others picking up the Rambus Inc. PR. Maybe a fallout from the bounce up an increased interest? Maybe part of the reason for the bounce or less-than-expected decline after the bounce? Maybe Rambus Inc. PR made a real effort to get noticed? Happy for any two of the three. No, thrilled.

Rambus Inc. (Nasdaq: RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced it has released the first physical layer (PHY) high-speed interface design from its Bangalore India Design Center. Based on Rambus’ proven high-speed PHY architecture, the PCI Express* design is optimized for TSMC’s 90nm process node and fully functional in silicon with all necessary tests checked at its maximum data rate of 2.5GHz. The silicon sample meets characterization across voltage and temperature ranges in compliance with the PCI-SIG® specification.

Here are a couple:


Design & Reuse

Electronic Engineering Times

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