Wednesday, October 18, 2006

Rambus Inc. patent hat trick

United States Patent 7,124,270

Dillon, legal representative, et al. October 17, 2006

Transceiver with latency alignment circuitry

Abstract
A transceiver device comprises a transmitter to transmit signals over a plurality of conductors to a memory device. An interface receives control information from a serial communication path coupled to a controller device. The control information is provided to the memory device as the signals using the transmitter. A register stores a control parameter that specifies a drive strength adjustment to the signals to transmit over the plurality of conductors to the memory device using the transmitter.

Inventors: Dillon, legal representative; Nancy D. (Washington, VA), Donnelly; Kevin (Los Altos, CA), Johnson; Mark (Los Altos, CA), Tran; Chanh (San Jose, CA), Dillon, deceased; John B. (Palo Alto, CA)

Assignee: Rambus Inc. (Los Altos, CA)

Appl. No.: 11/078,577

Filed: March 11, 2005

****

United States Patent 7,124,221

Zerbe, et al. October 17, 2006

Low latency multi-level communication interface

Abstract
A memory system uses multiple pulse amplitude modulation (multi-PAM) output drivers and receivers to send and receive multi-PAM sigsnals. A multi-PAM signal has more than two voltage levels, with each data interval now transmitting a "symbol" at one of the valid voltage levels. In one embodiment, a symbol represents two or more bits. The multi-PAM output driver drives an output symbol onto a signal line. The output symbol represents at least two bits that include a most significant bit (MSB) and a least significant bit (LSB). The multi-PAM receiver receives the output symbol from the signal line and determines the MSB and the LSB.

Inventors: Zerbe; Jared L. (Woodside, CA), Garlepp; Bruno W. (Austin, TX), Chau; Pak S. (San Jose, CA), Donnelly; Kevin S. (Los Altos, CA), Horowitz; Mark A. (Menlo Park, CA), Sidiropoulos; Stefanos (Palo Alto, CA), Garrett, Jr.; Billy W. (Mountain View, CA), Werner; Carl W. (San Jose, CA)

Assignee: Rambus Inc. (Los Altos, CA)

Appl. No.: 09/478,916

Filed: January 6, 2000

***

United States Patent 7,122,889

Belgacem October 17, 2006

Semiconductor module

Abstract
The semiconductor module includes a substrate, at least one semiconductor, and electrical contacts. The substrate includes a base layer having a substantially planar base layer first surface opposing a substantially planar base layer second surface. The base layer first surface is exposed to atmosphere and where the base layer is electrically conductive. The substrate also includes an insulator layer having a substantially planar insulator layer first surface opposing a substantially planar insulator layer second surface. The base layer second surface and the insulator layer first surface are adjacent and contiguous to one another and where the insulator layer is electrically non-conductive. Finally, the substrate includes a conductive layer having a substantially planar conductive layer first surface opposing a substantially planar conductive layer second surface. The insulator layer second surface and the conductive layer first surface are adjacent and contiguous to one another and where the conductive layer is electrically conductive.

Inventors: Belgacem; Haba (Cupertino, CA)

Assignee: Rambus, Inc. (Los Altos, CA)

Appl. No.: 10/894,693

Filed: July 19, 2004

Hat tip to FinzToRite for the links.

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