Last May, Rambus, Inc., mailed “save the date” announcements for its barbeque of Micron, Infineon, Hynix and “Does”.
Stay tuned . . . . and please RSVP.
*****Upate*****
Tessera's patented packaging technology was a necessary component of RDRAM products, and the amended complaint refers to several documents now in the public record which we believe show that the defendants colluded to prevent RDRAM products from competing fairly in the marketplace.
Hat tip to Joe of the Pinehurst Thread for the additional link (that wasn't working earlier today).

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